CREDIT: Master Bond
Master
Bond Supreme 11AOHTMed is a two-component epoxy featuring thermal conductivity
and electrical insulation. This system fully passes ISO 10993-5 testing for
non-cytotoxicity and is recommended for bonding and sealing in medical device
applications.
Supreme
11AOHTMed has reliable electrical insulation properties with a volume
resistivity exceeding 1014 ohm-cm at 75°F. It also exhibits thermal
conductivity of around 4 to 5 BTU·in/ft²·hr·°F (0.58W/m/K to 0.72W/m/K). The
system provides high bond strength properties with a lap shear strength of
3,200psi to 3,400psi, a tensile strength of 7,000psi to 8,000psi and a
compressive strength of 20,000psi to 22,000psi. This toughened formulation is
designed to withstand thermal cycling and offers a wide service temperature
range from -112°F to +400°F (-80°C to 204°C).
Supreme
11AOHTMed cures at room temperature in 24 to 36 hours, and faster with heat, in
1 to 2 hours at 200°F. To optimize properties, the recommended cure schedule is
overnight at room temperature, followed by a post cure at 120°F to 150°F for 2
to 3 hours or preferably longer. It bonds well to a wide variety of substrates
including metals, ceramics, glass, rubbers, and many plastics. This epoxy
system has a convenient 1:1 mix ratio by weight, with the mixed material being
a thixotropic paste. To eliminate the need for manual measuring and mixing, it
can be packaged in double barrel cartridges for gun kits. It is also available
in standard jars and cans, ranging in size from ½ pint to gallon containers.
Master
Bond adhesives for medical device manufacturing
Supreme 11AOHTMed is a thermally conductive, electrically isolating epoxy
offering high strength and a wide service temperature range. This two-component
epoxy passes ISO 10993-5 certification for non-cytotoxicity and is well suited
for a variety of bonding and sealing applicationsin medical device assembly.