CREDIT: MASTER BOND
Master Bond LED415DC90Med is a one-component, dual-cure adhesive system designed for high-speed manufacturing of medical electronic devices. It cures rapidly without oxygen inhibition upon exposure to 405nm LED light, followed by a short 30 to 45 minute heat cure at 90°C to 95°C, making it well-suited for bonding heat sensitive components. LED415DC90Med passes ISO 10993-5 requirements for non-cytotoxicity and resists common medical sterilants, including glutaraldehyde, peracetic acid, ethylene oxide, and gamma radiation.
Unlike conventional dual cure adhesives that limit light penetration to approximately 1mm, LED415DC90Med can partially cure or fixture sections up to 6mm deep when exposed to 405nm LED light at the appropriate intensity and for a sufficient duration. This deeper cure capability enables the fixturing of opaque components by allowing light penetration through the adhesive from the sides. A subsequent cure at 90°C to 100°C for 30 to 60 minutes is recommended to optimize strength and overall performance.
LED415DC90Med has a thixotropic index of 5.53 at room temperature. It exhibits a tensile strength of 5,500psi to 6,500psi, a tensile modulus of 450,000psi to 550,000psi, and a lap shear strength exceeding 1,000psi (aluminum to aluminum). This rigid system cures to a Shore D hardness of 85 to 90 with an elongation of 1% to 3% at 75°F. It is serviceable from -80°F to +350°F, electrically non-conductive (volume resistivity > 1014 ohm-cm), and bonds well to a variety of substrates, including plastics, glass, and metals. LED415DC90Med is available in syringes, 1/2 pint, pint, and quart containers.