High-precision motion and control solutions

PI’s newest brochure, “Driving Future Technologies” provides precision motion solutions to all industries that work with laser and optical technologies, including material processing, test & metrology, optics alignment, and micro-assembly.

Individual applications addressed in the new brochure are:

• Assembly and Packaging of Photonic Devices
• Laser Seam Welding of Electronic Packages Using Galvo Scanners
• Laser Drilling of High-Density Micro Holes
• Wafer Stealth Dicing
• Wafer Inspection and Metrology
• Characterization of Light Emitting Devices such as Micro LEDs, SiP Wafers, etc.
• Seam Sealing of Electronic Packages Using Pulsed Laser Sources