Sidestackable PinBall sockets are available with expand pitch packages

Aries Electronics has expanded the range of its side-stackable Pin- Ball socket to include pitch packages from 0.50 mm through 0.80 mm. The device is ideal for applications using BGA, LGA, CSP, and other devices on a 0.50 mm or larger pitch.

The space-saving sockets can be soldered sideby- side, directly to the existing footprint of a PC board. Clearances range from 0.5 mm to 2.0 mm depending on the pitch. The socket bolt tabs take up minimal space to allow for maximum component space around the socket.

The PinBall Socket incorporates Aries' spring probe technology, with a spring probe contact force of 12g to 15g per contact. The interposer on the top of the socket features two chip guides that help align the device with the spring probes and provide a positive lid compression stop to accurately control the spring probe deflection.

Users have the choice of either an aluminum cover or a standard or customized aluminum heatsink. The lid slides on and off easily with a few quick turns of the nut driver tool, which is included. The socket is available in two hold-down styles: two-bolt for 15 mm or smaller packages or four-bolt for 16 mm to 50 mm packages.

The new socket features 63/37 tin-lead solderballs on the PCB mating side and a male spring probe on the device mating side. The body is constructed of standard FR-4 material. The spring probe pins are beryllium copper alloy with 30 µ in. minimum gold over 30 µ in. minimum nickel and the hardware is stainless steel.

Aries Electronics Inc.
Frenchtown, NJ
arieselec.com