Noritake has developed a stronger, more powerful polyimide bond to improve wheel wear. The new polyimide bond, when applied to grinding wheels, provides for longer life, increased stability, and grain retention. Since wheel wear of the new BI bond is significantly less than conventional resin bond, finer grit sizes can be used. Because of this, the overall ground surface quality is much better. In addition, the BI bond can be utilized for soft metal bonded wheel applications with better quality and performance.
Noritake Co., Inc. Abrasives Division Cincinnati, OH noritake.com Booth #B-6827
Explore the July August 2006 Issue
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